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Semiconductor assembly equipment market share worldwide from 2017 to 2024, by production process

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Release date

April 2025

Region

Worldwide

Survey time period

2017 to 2024

Citation formats

Semiconductor assembly equipment market share 2017-2024, by production process

Published by
Petroc Taylor,
May 20, 2025

In 2024, die attach accounted for ** percent of the global assembly equipment market, while wire bonding accounted for ** percent. Other assembly methods such as inspection or dicing, or even other bonding, accounted for ** percent of the market in 2024.

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Overview

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Special focus: TSMC

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Topics

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