The statistic reveals the percentage of wafer-level chip-scale packages (WLCSP) in high-end smartphones, as of 2015. In the Huawei Ascend Mate *, ** percent of the chips in the smart phone use wafer-level chip-scale packages.
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Applied Materials. (December 7, 2015). Percentage of wafer-level chip-scale packages (WL-CSP) in high-end smartphones, as of 2015, by key smartphone [Graph]. In ÌÇÐÄÆƽâ°æ. Retrieved July 28, 2026, from /statistics/591964/worldwide-high-end-smartphones-wl-csp-packages-share/
Applied Materials. "Percentage of wafer-level chip-scale packages (WL-CSP) in high-end smartphones, as of 2015, by key smartphone." Chart. December 7, 2015. ÌÇÐÄÆƽâ°æ. Accessed July 28, 2026. /statistics/591964/worldwide-high-end-smartphones-wl-csp-packages-share/
Applied Materials. (2015). Percentage of wafer-level chip-scale packages (WL-CSP) in high-end smartphones, as of 2015, by key smartphone. ÌÇÐÄÆƽâ°æ. ÌÇÐÄÆƽâ°æ Inc.. Accessed: July 28, 2026. /statistics/591964/worldwide-high-end-smartphones-wl-csp-packages-share/
Applied Materials. "Percentage of Wafer-level Chip-scale Packages (Wl-csp) in High-end Smartphones, as of 2015, by Key Smartphone." ÌÇÐÄÆƽâ°æ, ÌÇÐÄÆƽâ°æ Inc., 7 Dec 2015, /statistics/591964/worldwide-high-end-smartphones-wl-csp-packages-share/
Applied Materials, Percentage of wafer-level chip-scale packages (WL-CSP) in high-end smartphones, as of 2015, by key smartphone ÌÇÐÄÆƽâ°æ, /statistics/591964/worldwide-high-end-smartphones-wl-csp-packages-share/ (last visited July 28, 2026)
Percentage of wafer-level chip-scale packages (WL-CSP) in high-end smartphones, as of 2015, by key smartphone [Graph], Applied Materials, December 7, 2015. [Online]. Available: /statistics/591964/worldwide-high-end-smartphones-wl-csp-packages-share/
