Share of global semiconductor assembly, testing, and packaging (ATP) capacity in the Asia-Pacific region in 2022, with a forecast for 2032, by technology and country or territory
Characteristic
Japan
South Korea
Taiwan
China
Malaysia
Philippines
Thailand
Singapore
Vietnam*
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In 2022, the Asia-Pacific region accounted for more than ** percent of global semiconductor assembly, testing, and packaging (ATP) capacity, with China leading at ** percent and Taiwan at ** percent. By 2032, Vietnam was forecasted to see a dramatic increase in its share of global chip ATP capacity, rising from less than *** percent to percent.
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SIA. (May 7, 2024). Share of global semiconductor assembly, testing, and packaging (ATP) capacity in the Asia-Pacific region in 2022, with a forecast for 2032, by technology and country or territory [Graph]. In ÌÇÐÄÆÆ½â°æ. Retrieved July 31, 2026, from /statistics/1550941/apac-share-of-global-chip-atp-capacity-by-country/
SIA. "Share of global semiconductor assembly, testing, and packaging (ATP) capacity in the Asia-Pacific region in 2022, with a forecast for 2032, by technology and country or territory." Chart. May 7, 2024. ÌÇÐÄÆÆ½â°æ. Accessed July 31, 2026. /statistics/1550941/apac-share-of-global-chip-atp-capacity-by-country/
SIA. (2024). Share of global semiconductor assembly, testing, and packaging (ATP) capacity in the Asia-Pacific region in 2022, with a forecast for 2032, by technology and country or territory. ÌÇÐÄÆÆ½â°æ. ÌÇÐÄÆÆ½â°æ Inc.. Accessed: July 31, 2026. /statistics/1550941/apac-share-of-global-chip-atp-capacity-by-country/
SIA. "Share of Global Semiconductor Assembly, Testing, and Packaging (Atp) Capacity in The Asia-pacific Region in 2022, with a Forecast for 2032, by Technology and Country or Territory." ÌÇÐÄÆÆ½â°æ, ÌÇÐÄÆÆ½â°æ Inc., 7 May 2024, /statistics/1550941/apac-share-of-global-chip-atp-capacity-by-country/
SIA, Share of global semiconductor assembly, testing, and packaging (ATP) capacity in the Asia-Pacific region in 2022, with a forecast for 2032, by technology and country or territory ÌÇÐÄÆÆ½â°æ, /statistics/1550941/apac-share-of-global-chip-atp-capacity-by-country/ (last visited July 31, 2026)
Share of global semiconductor assembly, testing, and packaging (ATP) capacity in the Asia-Pacific region in 2022, with a forecast for 2032, by technology and country or territory [Graph], SIA, May 7, 2024. [Online]. Available: /statistics/1550941/apac-share-of-global-chip-atp-capacity-by-country/