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Share of global wafer fabrication capacity in the Asia-Pacific region in 2022, by technology and region

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Release date

May 2024

Region

Asia, APAC

Survey time period

2022

Supplementary notes

* Discretes, analog, optoelectronics, and sensors.

Citation formats

Share of global wafer fabrication capacity APAC 2022, by technology and region

Published by
Petroc Taylor,
Jul 6, 2026

In 2022, four countries and territories in the Asia-Pacific region accounted for more than ** percent of the global wafer fabrication across process technologies. South Korea accounted for more than half of the global wafer fabrication capacity for dynamic random access memory (DRAM) process technology, while Taiwan held nearly ** percent of the global capacity for logic process technologies with nodes smaller than *** ²Ô²¹²Ô´Ç³¾±ð³Ù±ð°ù²õ.Ìý

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