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In the third quarter of 2021, ASE ranked first among companies in the global outsourced semiconductor assembly and test (OSAT) market, posting revenues of **** billion U.S. dollars. As noted by the source, this represented a **** percent year-on-year (YoY) increase, supported by the continued growth and demand for end-devices.

Semiconductor assembly and testing

After an integrated circuit (IC) fabrication by an integrated device manufacturer (IDM) or semiconductor foundry, the chip must be tested, assembled, and packaged. This can be done by the IDM or foundry itself or outsourced to an OSAT. An OSAT company will offer third-party IC packaging and testing services to a client, protecting the chips from damage and identifying any defects.

Semiconductor packaging services

Foundries and IDMs have stepped-up investment in advanced packaging services, notably developments in chiplet design. Chiplet integration requires advanced packaging and stacking technologies - in other words, connecting these chiplets in different configurations to function as a single unit based on the needs Demand for these technologies is expected to grow in the coming years. To support this, Taiwan Semiconductor Manufacturing Company (TSMC) has outlined plans to build additional packaging facilities, while Intel has announced plans for collaborative research with IBM that will include a focus on next-generation packaging technologies.